Abstract: Direct bonding of InP active regions on a Si waveguide circuit is demonstrated using chip-on-wafer hydrophilic bonding process, and PL spectra from different epitaxial structures are ...
Thanks to computer numerical control (CNC) fabrication technologies, the method may also be applied to design-laminated timber gridshells. Credit: ©2025 Masaaki Miki and Toby Mitchell CC-BY-ND A new ...
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